KJZZ is a service of Rio Salado College,
and Maricopa Community Colleges

Copyright © 2025 KJZZ/Rio Salado College/MCCCD
Play Live Radio
Next Up:
0:00
0:00
0:00 0:00
Available On Air Stations

Amkor Technology breaks ground on $7 billion semiconductor packaging facility near TSMC

Conceptual design of Amkor Technology Inc's $2 billion semiconductor packaging and test facility in north Peoria.
City of Peoria
Conceptual design of Amkor Technology Inc.'s semiconductor packaging and test facility in north Peoria.

A new semiconductor manufacturing plant broke ground in Peoria this week.

Amkor’s $7 billion facility will reportedly be one of the largest chip packaging plants in the country and is expected to provide up to 3,000 jobs.

The first phase of construction is expected to be finished in about two years, with the first chips being made in 2028.

When all is said and done, the 750,00-square-foot semiconductor factory will provide chips to NVIDIA and Apple, which will be used for artificial intelligence.

“Our goal is we want more. Peoria is open for business. I’m already recruiting as some of you can attest. We are open for business and we want to create more jobs,”
Peoria Mayor Jason Beck said.

The factory is being built near Loop 303 and Lake Pleasant Parkway, not far from the TSMC campus.

More business news from KJZZ

Greg Hahne started as a news intern at KJZZ in 2020 and returned as a field correspondent in 2021. He learned his love for radio by joining Arizona State University's Blaze Radio, where he worked on the production team.