The Tempe-based semiconductor company Amkor has announced that it will triple the size of its packaging and testing facility it’s building in Arizona.
The announcement comes as the U.S. government aims to onshore advanced manufacturing.
Advanced packaging is the critical process of taking a raw computer chip and putting it in the casing that integrates it with the rest of an electronic device. It’s mostly done overseas.
Amkor first announced it was investing $2 billion in Arizona to build an advanced packaging facility in 2023. But this week’s announcement brings that up to $12 billion. And the facility will almost triple in size to over a million square feet.
Apple is set to be the first customer and will have Amkor package their chips after being made by TSMC, which also plans to invest billions expanding semiconductor manufacturing in the state.
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